Integrating dimensions to get more out of Moore’s Law and advance electronics

Penn State researchers demonstrated 3D integration of semiconductors at a massive scale, characterizing tens of thousands of devices using 2D transistors made with 2D semiconductors, enabling electronic gadgets to possibly become smarter and more versatile.  Credit: Elizabeth Flores-Gomez Murray/Pennsylvania State University Materials Research Institute

Moore’s Law, a fundamental scaling principle for electronic devices, forecasts that the number of transistors on a chip will double every two years, ensuring more computing power—but a limit exists.

Today’s most advanced chips house nearly 50 billion transistors within a space no larger than your thumbnail. The task of cramming even more transistors into …
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